The field of electronic packaging continues to grow at an amazing rate. The electronic packaging engineer requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis may change from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on thermal design.
Thermal analysis of electronic equipment is becoming one of the primary aspects of many packaging jobs. An up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, is the result of realizing that the thermal problems will only get worse.
As the size of the electronic circuit is reduced, speed is increased. As the power of these systems increases and the space allotted to them diminishes, heat flux or density (heat per unit area, W/m 2
) has spiraled. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more popular, allowing even smaller systems to be designed.
This reference book of formulas is the result of sifting through the volumes of data on general heat transfer and extracting the formulas that are needed by today’s electronic packaging engineers. The reader will immediately notice the emphasis placed on fluid dynamics formulas in this book. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to
gain as much understanding about the underlying mechanisms of fluid motion as possible. The application of advanced thermal management techniques requires a background in fluid dynamics.